Balluff’s Distributed Modular I/O In The Food Processing and Beverage Industry
April 1, 2017
Balluff has introduced a machine mount, IP69K protection rated, ECOLAB certified distributed I/O modules powered by EtherNet/IP, PROFINET, and IO-Link. End users and machine builders of automation in the food, meat, dairy and beverage industries that need to follow stringent food safety requirements can now utilize the full benefits of distributed modular I/O architecture for all the required I/O and sensor connectivity.
The IP69K portfolio includes network I/O, IO-Link masters and IO-Link I/O hubs. These distributed I/O modules can be mounted closer to sensors and actuators to reduce troublesome cable routing. The entire portfolio of IP69K modules utilizes standard M12 connections to sensors. All the modules are equipped with onboard diagnostics for ease of integration and maintenance.
ECOLAB certified stainless steel V4A (1.4571) housing with elevated two-hole mounting makes these modules easy for cleaning with high-pressure fluids or steam wash or corrosive chemicals.
The IO-Link onboard provides the abilitiy to connet a multitude of smart devices, analog devices or discrete I/O sensors and valves. Balluff’s IO-Link I/O hubs, with expansion capability, can scale-up to 240 I/O points on the single network node eliminating network clutter and cost involved with traditional network I/O solutions. IO-Link enables machine builders to bring the status and configuration of sensors on-board the controller with the same M12 wash-down rated sensor cable that is used for standard 3-wire sensors. Balluff’s new wash-down I/O portfolio simplifies design, installation and maintenance of traditionally difficult I/O applications.
For more information:
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